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M.P.F.
ON-LINE WITH BASE PLATE BAKING FURNACE SE-200P
| SE-300-SPR | SE-200-P |
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- Using the method of spraying,
the amount of resin is consumed about half of that the traditional bubble-type
soldering machine when PCB is inserted. In addition, this method can create pollution-free
environment besause of no need to use CFC to clean PCB.
- This
machine can work with any type of soldering macnine by connecting with the conveyor
automatically.
- The
enclosure design equipped with filter, which can be removed for cleaning,
provides a working environment with out pollution.
- The
number of spray nozzle, whether they are automatiocally movable or fixed type,
can be chosen depending on the width of PCB.
- Use
PLC precisely control the time of spraying fog.
- A6" touch monitor allows to control the spray gun position and production volume can be
counted.
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| Specifications:
PCB BAKING MACHINE | | | Size:1700(L)
x 1000(W) x 1350(H) mm | | Weight:about
500Kgs | | Conveyor
rail:Heat-resistance rail, 2000 mm | | Conveying
speed:0-2400 mm/min. | | Motor:90W
x 1 | | Pre-heater:12
PCS, two-staged type, pottery-carbon tube 1500 mm ong | |
Exhaust:8" x 1 |
| Power consumpton:3ψ
or 1ψ 220V 20A |
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| Type
\ Model | SE-300-SPR |
| Power |
3ψ or 1ψ
220V 95w | | Conveyor | Speed |
0~2500
mm/min. | | Tiltiing
Angle | 0°~4° |
| Double
Nozzle Spray Type Flux | Flux
Capacity | 8L |
| Air
Pressure | 1.5Kg/cm2 |
| Size |
1500(L)
x 800(W) x1330(H) mm | | Weight |
about 270Kgs |
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