ON-LINE WITH BASE PLATE BAKING FURNACE
- Using the method of spraying,
the amount of resin is consumed about half of that the traditional bubble-type
soldering machine when PCB is inserted. In addition, this method can create pollution-free
environment besause of no need to use CFC to clean PCB.
machine can work with any type of soldering macnine by connecting with the conveyor
enclosure design equipped with filter, which can be removed for cleaning,
provides a working environment with out pollution.
number of spray nozzle, whether they are automatiocally movable or fixed type,
can be chosen depending on the width of PCB.
PLC precisely control the time of spraying fog.
- A6" touch monitor allows to control the spray gun position and production volume can be
PCB BAKING MACHINE
x 1000(W) x 1350(H) mm|
rail:Heat-resistance rail, 2000 mm|
PCS, two-staged type, pottery-carbon tube 1500 mm ong|
Exhaust:8" x 1
or 1ψ 220V 20A|
3ψ or 1ψ
Nozzle Spray Type Flux||Flux
x 800(W) x1330(H) mm